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tl(re,se,oe,ye,pye ,ge,fge,pge)1008a(t04) 2008-08-04 1 toshiba led lamps tlre1008a(t04), tlse1008a(t04), tloe1008a(t04), tlye1008a(t04), tlpye1008a(t04), tlge1008a(t04), tlfge1008a(t04), tlpge1008a(t04) panel circuit indicators ? surface-mount devices ? 1.6 (l) mm 0.8 (w) mm 0.6 (h) mm ? ingaa ? p leds ? replacing standard-intensity le ds with high-intensity ones helps increase the brightness or reduce the power consumption of end products. ? colors: red, orange, yellow, pure yellow, green, pure green ? applications: backlighting for battery-powered equipment pilot lamps for mobile handsets low-power electronic equipment, etc. ? standard embossed tape pa cking: t04 (4000/reel) 4-mm tape reel color and material unit: mm jedec D jeita D toshiba 4-1c1 weight: 0.0013 g (typ.) part number color material tlre1008a red tlse1008a red tloe1008a orange tlye1008a yellow tlpye1008a pure yellow tlge1008a green tlfge1008a green tlpge1008a pure green ingaa ?p
tl(re,se,oe,ye,pye ,ge,fge,pge)1008a(t04) 2008-08-04 2 absolute maximum ratings (ta = 25c) part number forward current i f (ma) please see note 1 reverse voltage v r (v) power dissipation p d (mw) operation temperature t opr (c) storage temperature t stg (c) tlre1008a tlse1008a tloe1008a tlye1008a tlpye1008a tlge1008a tlfge1008a tlpge1008a 25 4 60 ?40 to 85 ? 40 to 100 note: using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operat ing temperature/current/voltage, etc. ) are within the absolute maximum ratings. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook (?handling precautions?/?derating concept and methods?) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). note 1: forward current derating electrical characteristics (ta = 25c) forward voltage v f reverse current i r part number min typ. min i f max v r tlre1008a 1.6 1.9 2.4 tlse1008a 1.6 1.9 2.4 tloe1008a 1.6 2.0 2.4 tlye1008a 1.6 2.0 2.4 tlpye1008a 1.6 2.0 2.4 tlge1008a 1.6 2.0 2.4 tlfge1008a 1.6 2.0 2.4 tlpge1008a 1.6 2.1 2.4 20 50 4 unit v ma a v 0 40 30 0 80 60 20 100 20 10 40 ambient temperature ta (c) i f ? ta allowable forward current i f (ma)
tl(re,se,oe,ye,pye ,ge,fge,pge)1008a(t04) 2008-08-04 3 optical characteristics?1 (ta = 25c) luminous intensity i v part number min typ. max i f available i v rank please see note 2 tlre1008a 27.2 70 ? 20 l / m / n / p tlse1008a 47.6 135 ? 20 m / n / p / q tloe1008a 47.6 150 ? 20 m / n / p / q tlye1008a 27.2 105 ? 20 l / m / n / p tlpye1008a 27.2 100 ? 20 l / m / n / p tlge1008a 27.2 70 ? 20 l / m / n / p tlfge1008a 15.3 40 ? 20 k / l / m / n tlpge1008a 4.76 18 ? 20 h / j / k / l unit mcd mcd mcd ma ? note 2: the specification on the ab ove table is used for iv classification of leds in toshiba facility. each reel includes the same rank leds. let the delivery ratio of eac h rank be unquestioned. luminous intensity i v rank min max h 4.76 12.9 j 8.5 23 k 15.3 41.4 l 27.2 73.6 m 47.6 129 n 85 230 p 153 414 q 272 736 unit mcd mcd optical characteristics?2 (ta = 25c) emission spectrum peak emission wavelength p ? dominant wavelength d part number min typ. max typ. min typ. max i f tlre1008a ? 644 ? 18 624 630 638 tlse1008a ? 623 ? 15 607 613 621 tloe1008a ? 612 ? 15 599 605 613 tlye1008a ? 590 ? 13 581 587 595 tlpye1008a ? 583 ? 13 574 580 586 tlge1008a ? 574 ? 11 565 571 576 tlfge1008a ? 568 ? 11 559 565 571 tlpge1008a ? 562 ? 11 ? 558 564 20 unit nm nm nm ma the cautions ? this visible led lamp also emits some ir light. if a photodetector is located near the led lamp, please ensure that it will not be affected by the ir light. ? this product is designed as a general display light sou rce usage, and it has applied the measurement standard that matched with the sensitivity of human's eyes. ther efore, it is not intended for usage of functional application (ex. light source for sensor, optical communi cation and etc) except general display light source.
tl(re,se,oe,ye,pye ,ge,fge,pge)1008a(t04) 2008-08-04 4 tlre1008a i f = 20 ma ta = 25c 0 640 0.4 1.0 0.8 580 680 660 620 600 700 0.6 0.2 0.1 40 0.3 0.5 3 1 ? 20 80 60 20 0 100 1 1.6 2.0 3 5 50 10 1.7 2.2 30 1.8 2.1 1.9 ta = 25c relative luminous intensity forward voltage v f (v) i f ? v f forward current i f (ma) forward current i f (ma) i v ? i f luminous intensity i v (mcd) case temperature tc (c) i v ? tc relative luminous intensity i v wavelength (nm) wavelength characteristic ta = 25c 1 100 1 50 50 30 10 3 5 3 5 10 30 100 ( t yp . ) ( t yp . ) ( t yp . ) ( t yp . )
tl(re,se,oe,ye,pye ,ge,fge,pge)1008a(t04) 2008-08-04 5 tlse1008a i f = 20 ma ta = 25c 0 640 0.4 1.0 0.8 580 680 660 620 600 700 0.6 0.2 ta = 25c 1 100 30 1.6 2.1 2.0 1.7 2.2 10 3 1.8 50 5 1.9 0.1 3 ? 20 80 60 0 100 0.5 20 0.3 40 1 relative luminous intensity forward voltage v f (v) i f ? v f forward current i f (ma) forward current i f (ma) i v ? i f luminous intensity i v (mcd) case temperature tc (c) i v ? tc relative luminous intensity i v wavelength (nm) wavelength characteristic ( t yp . ) ( t yp . ) 100 1 50 50 30 10 3 5 3 5 10 100 300 ta = 25c 30
tl(re,se,oe,ye,pye ,ge,fge,pge)1008a(t04) 2008-08-04 6 tloe1008a 0.1 10 3 80 60 100 1 0.3 20 5 0.5 ? 20 0 40 i f = 20 ma ta = 25c 0 600 0.4 1.0 0.8 540 640 620 580 560 660 0.6 0.2 ta = 25c 1 100 30 1.7 2.2 2.1 1.8 2.3 10 3 1.9 50 5 2.0 relative luminous intensity forward voltage v f (v) i f ? v f forward current i f (ma) forward current i f (ma) i v ? i f luminous intensity i v (mcd) case temperature tc (c) i v ? tc relative luminous intensity i v wavelength (nm) wavelength characteristic 100 1 50 50 30 10 3 5 3 5 10 30 100 300 ta = 25c ( t yp . ) ( t yp . ) ( t yp . ) ( t yp . )
tl(re,se,oe,ye,pye ,ge,fge,pge)1008a(t04) 2008-08-04 7 tlye1008a 100 1 50 50 30 10 3 5 3 5 10 30 100 300 ta = 25c i f = 20 ma ta = 25c 0 600 0.4 1.0 0.8 540 640 620 580 560 660 0.6 0.2 0.1 10 3 80 60 100 1 0.3 20 5 0.5 ? 20 0 40 ta = 25c 1 100 30 1.7 2.2 2.1 1.8 2.3 10 3 1.9 50 5 2.0 relative luminous intensity forward voltage v f (v) i f ? v f forward current i f (ma) forward current i f (ma) i v ? i f luminous intensity i v (mcd) case temperature tc (c) i v ? tc relative luminous intensity i v wavelength (nm) wavelength characteristic ( t yp . ) ( t yp . ) ( t yp . ) ( t yp . )
tl(re,se,oe,ye,pye ,ge,fge,pge)1008a(t04) 2008-08-04 8 tlpye1008a 100 1 50 50 30 10 3 5 3 5 10 30 100 300 ta = 25c i f = 20 ma ta = 25c 0 600 0.4 1.0 0.8 540 640 620 580 560 660 0.6 0.2 0.1 10 3 80 60 100 1 0.3 20 5 0.5 ? 20 0 40 ta = 25c 1 100 30 1.7 2.2 2.1 1.8 2.3 10 3 1.9 50 5 2.0 relative luminous intensity forward voltage v f (v) i f ? v f forward current i f (ma) forward current i f (ma) i v ? i f luminous intensity i v (mcd) case temperature tc (c) i v ? tc relative luminous intensity i v wavelength (nm) wavelength characteristic ( t yp . ) ( t yp . ) ( t yp . ) ( t yp . )
tl(re,se,oe,ye,pye ,ge,fge,pge)1008a(t04) 2008-08-04 9 tlge1008a 0.1 10 3 80 60 100 1 0.3 20 5 0.5 ? 20 0 40 i f = 20 ma ta = 25c 0 0.4 1.0 0.8 540 0.6 0.2 620 600 580 560 ta = 25c 1 100 30 1.7 2.2 2.1 1.8 2.3 10 3 1.9 50 5 2.0 relative luminous intensity forward voltage v f (v) i f ? v f forward current i f (ma) forward current i f (ma) i v ? i f luminous intensity i v (mcd) case temperature tc (c) i v ? tc relative luminous intensity i v wavelength (nm) wavelength characteristic ( t yp . ) ( t yp . ) ( t yp . ) ( t yp . ) 100 1 50 50 30 10 3 5 3 5 10 30 100 300 ta = 25c
tl(re,se,oe,ye,pye ,ge,fge,pge)1008a(t04) 2008-08-04 10 tlfge1008a 0.1 10 3 80 60 100 1 0.3 20 5 0.5 ? 20 0 40 i f = 20 ma ta = 25c 0 0.4 1.0 0.8 520 0.6 0.2 600 580 560 540 ta = 25c 1 100 30 1.7 2.2 2.1 1.8 2.3 10 3 1.9 50 5 2.0 relative luminous intensity forward voltage v f (v) i f ? v f forward current i f (ma) case temperature tc (c) i v ? tc relative luminous intensity i v wavelength (nm) wavelength characteristic forward current i f (ma) i v ? i f luminous intensity i v (mcd) ( t yp . ) ( t yp . ) ( t yp . ) ( t yp . ) 100 1 50 50 30 10 3 5 3 5 10 30 100 300 ta = 25c
tl(re,se,oe,ye,pye ,ge,fge,pge)1008a(t04) 2008-08-04 11 tlpge1008a i f = 20 ma ta = 25c 0 0.4 1.0 0.8 520 0.6 0.2 600 580 560 540 0.1 10 3 80 60 100 1 0.3 20 5 0.5 ? 20 0 40 relative luminous intensity forward current i f (ma) i v ? i f case temperature tc (c) i v ? tc relative luminous intensity i v wavelength (nm) wavelength characteristic luminous intensity i v (mcd) 1 100 30 1.7 2.2 2.1 1.8 2.3 10 3 1.9 50 5 2.0 forward voltage v f (v) i f ? v f forward current i f (ma) ta = 25c ( t yp . ) ( t yp . ) 10 1 50 5 3 1 0.3 0.5 3 5 10 30 100 30 ta = 25c
tl(re,se,oe,ye,pye ,ge,fge,pge)1008a(t04) 2008-08-04 12 radiation pattern horizontal to polarity ta=25 vertical to polarity ( t yp . ) ( t yp . ) 30 40 0 0.2 0.4 0.6 0.8 0 10 20 30 40 50 60 70 80 90 10 20 50 60 70 80 90 1.0 0 0.2 0.4 0.6 0.8 0 10 20 30 40 50 60 70 80 90 10 20 30 40 50 60 70 80 90 1.0
tl(re,se,oe,ye,pye ,ge,fge,pge)1008a(t04) 2008-08-04 13 packaging these led devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid moisture absorption. the optical characteristics of the devi ces may be affected by exposure to moisture in the air before soldering and they should therefore be stored under the following conditions: 1. this moisture proof bag may be stored unopene d within 12 months at the following conditions. temperature: 5 c to 30 c humidity: 90% (max) 2. after opening the moisture proof bag, the devices should be assembled within 168 hours in an environment of 5c to 30c/70% rh or below. when performing lead(pb)-free soldering, the devices sh ould be assembled within 72 hours in an environment of 5c to 30c/70% rh or below. 3. if upon opening, the moisture in dicator card shows humidity 30% or above (color of indication changes to pink) or the expiration date has passed, the de vices should be baked in taping with reel. after baking, use the baked devices within 72 hours, but perform baking only once. baking conditions: 60 5c, for 12 to 24 hours. expiration date: 12 months from sea ling date, which is imprinted on the same side as this label affixed. 4. repeated baking can cause the pee ling strength of the taping to change , then leads to trouble in mounting. furthermore, prevent the devices from being destru cted against static electricity for baking of it. 5. if the packing material of laminate would be broken , the air tightness would deteriorate. therefore, do not throw or drop the packed devices. mounting method soldering ? reflow soldering (example) ? the products are evaluated using above reflow soldering conditions. no additi onal test is performed exceed the condition (i.e. the condition more than (*)max values) as a evaluation. please perform reflow soldering under the above conditions. ? please perform the first reflow soldering with reference to the above temperature profile and within 168 h of opening the package. ? second reflow soldering in case of second reflow soldering should be performed within 168 h of the first reflow under the above conditions. storage conditions before the second reflow soldering: 30 c, 70% rh (max) ? make any necessary soldering corrections manually. (only once at each soldering point) soldering iron: 25 w temperature: 300 c or less time: within 3 s ? do not perform wave soldering. 60 to 120 s max 140 to 160 c 10 s max 240 c max 4 c/s max 4 c/s max time (s) package surface temperature ( c) (*) (*) (*) (*) (*) (*) temperature profile for pb soldering (example)
tl(re,se,oe,ye,pye ,ge,fge,pge)1008a(t04) 2008-08-04 14 ? reflow soldering (example) ? the products are evaluated using above reflow soldering conditions. no additi onal test is performed exceed the condition (i.e. the condition more than (*)max values) as a evaluation. please perform reflow soldering under the above conditions. ? please perform the first reflow soldering with referenc e to the above temperature profile and within 72 h of opening the package. ? second reflow soldering in case of second reflow soldering should be performed within 72 h of the first reflow under the above conditions. storage conditions before the second reflow soldering: 30 c, 70% rh (max) ? make any necessary soldering corrections manually. (only once at each soldering point) soldering iron: 25 w temperature: 300 c or less time: within 3 s ? do not perform wave soldering. recommended soldering pattern cleaning when cleaning is required after soldering, toshiba recommends the following cleaning solvents. it is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the recommended conditions). in selecting the one for your actual usage, please perform sufficient review on washing condition, us ing condition and etc. asahi clean ak-225aes: (made by asahi glass) kao clean through 750h: (made by kao) pine alpha st-100s: (made by arakawa chemical) precaution when mounting do not apply force to the plastic part of the led under high-temperature conditions. to avoid damaging the led plastic, do not apply friction using a hard material. when installing the pcb in a product, ensure that the device does not come into contact with other cmponents. 0.8 0.7 0.8 (0.8) unit: mm temperature profile for pb-free soldering (example) time (s) 150 to 180 c max 4 c/s max 5 s max 260 c max 4 c/s max 30 to 50 s max 230 c 60 to 120 s (*) (*) (*) (*) (*) (*) (*) package surface temperature ( c)
tl(re,se,oe,ye,pye ,ge,fge,pge)1008a(t04) 2008-08-04 15 tape specifications 1. product number format the type of package used for shipment is denote d by a symbol suffix after the product number. the method of classification is as below. (however, this method does not apply to products whose electrical/optical characteristics differ from standard toshiba specifications) (1) tape type: t04 (4-mm pitch) (2) example 2. handling precautions tape material protected against static electricity. however, static electricity may occur depending on quantity of charged static electricity and a device may attach to a tape, or a device may be unstable when peeling a tape cover. (a) since tape materials may accumulate an electrosta tic charge, use an ionizer to neutralize the ambient air. (b) for transport and temporary storage of devices, use containers (boxes and bags) and jigs that are made of anti-static materials or of materials which dissipate electrostatic charge. 3. tape dimensions unit: mm symbol value tolerance symbol value tolerance d 1.50 +0.1/?0 p 2 2.00 0.05 e 1.75 0.1 w 8.00 0.1 p 0 4.00 0.1 p 4.00 0.1 t 0.20 0.05 a 0 0.90 0.1 f 3.50 0.05 b 0 1.75 0.1 d 1 0.60 0.05 k 0 0.75 0.1 a 0 p d 1 f e w polarity t k 0 b 0 d p 2 p 0 tlre1008a (t04) tape type toshiba product no.
tl(re,se,oe,ye,pye ,ge,fge,pge)1008a(t04) 2008-08-04 16 4. reel dimensions unit: mm 5. leader and trailer section of tape note 1: empty trailer section note 2: empty leader section 2 0.5 13 0.5 21 0.8 11.4 1 9 +1/-0 60 180 +0 ?4 (note 1) leading part 190 mm (min) 40 mm or more (note 2) 40 mm or more
tl(re,se,oe,ye,pye ,ge,fge,pge)1008a(t04) 2008-08-04 17 6. packing display (1) packing quantity reel 4,000 pcs carton 20,000 pcs (2) package form: each reel is sealed in an aluminum pack with silica gel. 7. label format (1) example: tlre1008a (t04) p/n: toshiba type tlre1008a addc (t04) q?ty 4,000 pcs lot number key code for tsb 32c 4000 (rank symbol) use under 5-30degc/70%rh within 72h sealed [[g]]/rohs compatible diffused in ***** *y380xxxxxxxxxxxxxxxxxx* assembled in ***** (2) label location tape reel direction label position label position ? reel ? carton ? the aluminum package in which the reel is supplied also has a copy of the label attached to center of one side.
tl(re,se,oe,ye,pye ,ge,fge,pge)1008a(t04) 2008-08-04 18 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively ?toshiba?), reserve the right to make changes to the in formation in this document, and related hardware, software a nd systems (collectively ?product?) without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba?s written permission, reproduc tion is permissible only if reproducti on is without alteration/omission. ? though toshiba works continually to improve product?s quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before creating and producing des igns and using, customers mus t also refer to and comply with (a) the latest versions of all re levant toshiba information, including without limitation, this d ocument, the specifications, the data sheets and applic ation notes for product and the precautions and conditions set forth in the ?tosh iba semiconductor reliability handbook? and (b) t he instructions for the application that product will be used with or for. custome rs are solely responsible for all aspects of t heir own product design or applications, incl uding but not limited to (a) determining th e appropriateness of the use of this product in such design or applications; (b) evaluating and det ermining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. toshiba assumes no liability for customers? product design or applications. ? product is intended for use in general el ectronics applications (e.g., computers, personal equipment, office equipment, measur ing equipment, industrial robots and home electroni cs appliances) or for specif ic applications as expre ssly stated in this document . product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality a nd/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or se rious public impact (?unintended use?). unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic s ignaling equipment, equipment used to control combustions or explosions, safety dev ices, elevators and escalato rs, devices related to el ectric power, and equipment used in finance-related fields. do not use product for unintended use unless specifically permitted in thi s document. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? a bsent a written signed agreement, except as provid ed in the relevant terms and conditions of sale fo r product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, co nsequential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? gaas (gallium arsenide) is used in product. gaas is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose gaas in product. ? do not use or otherwise make available product or related so ftware or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or m anufacturing of nuclear, chemical , or biological weapons or missi le technology products (mass destruction w eapons). product and related software and technology may be controlled under the japanese foreign exchange and foreign trade law and the u.s. expor t administration regulations. ex port and re-export of product or related software or technology are strictly prohibited exc ept in compliance with all applicable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of pro duct. please use product in compliance with all applicable laws and regula tions that regulate the inclusion or use of controlled subs tances, including without limitation, the eu rohs directive. toshiba assumes no liability for damages or losses occurring as a result o f noncompliance with applicable laws and regulations.

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